Responsibilities​

• Drive new lead frame concept and design to implementation, perform risk assessment on interaction of new lead frame material, concept and design at package assembly and supplier process

• Early involvement with R&D project teams in terms of piece part sourcing and qualification

• Drive Best in Cost Design, Technology and Material selection (design for manufacturing) to meet road map requirements

• Provide support in cost reduction programs (alternate sourcing, change of material, design changes and more) as well as piece part incoming quality, work with suppliers and designers to resolve technology/quality issues and be responsible for improvement programs

• Conduct supplier audit, provide support in supplier evaluation and document piece part specifications/regulatory to meet qualifications

• Conduct engineering change review for any piece part and supplier-related change

 

Requirements

• Min Bachelor's Degree/ Master/ PhD in Mechanical Engineering or Materials Science

• Min 5 years' experience in lead frame manufacturing process (metal stamping, metal rolling, copper etching, copper roughening, chemical process) in backend packaging development is a must

• Strong knowledge on material properties (physical, chemical, mechanical and electrical) of metals/alloys and its surface interactions behaviour (bulk material and plating layer characterization) will be an added advantage

• Proficient in mechanical drawing interpretations, AutoCAD, FMEA, statistical tools, Six Sigma, 8D and 5-Why

• Strong knowledge of analytical methods for material characterization and interpretation of results is desired

• A team player with good interpersonal and communication skills

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DISCLAIMER

The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

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We invite interested candidates to write-in with CV to Lee Shiow Chyn, EA 12C6130/ R1112042 semicon@hpspartners.com.sg 

 

We regret that only shortlisted candidates will be contacted for a discussion.