Responsibilities​

• Be part of Die Bond Unit Process Development as Staff/Senior Staff Engineer- Front of Line Die Attach to develop and qualify the new assembly packages, process and ensure meeting design to cost & design manufacturing

• To make improvements on current process, identifying area of improvements, efficiency and value engineering

• Drive for innovation and thinking out of box for any issue

• Monitor performance, quality and reliability of assembly process

• Conduct process knowledge transfer to segment team and ensure smooth process knowledge handover

• Support end to end on tooling and machine ramp up requirements

• Introduce, support and buy off new process/ equipment/ tooling and road mapping for development activities.

 

Requirements

• Bachelor or Master Degree in Mechanical Engineering, Material Science, Electronic/Electrical Engineering or Engineering Physics

• Minimum 10 years experience in Die Bond and Pre-Assembly area.

• Good knowledge on Die bond process, equipment and material such as epoxy glue, DAF and the interaction for wafer backside material to various lead frame materials, Pre-Assembly knowledge will be value add

• Familiar with e-clips process from die bonding, clip attach, reflow and flux cleaner equipment's. Having good knowledge for Die attach/clips attach tooling design and analysis.

• Hands-on knowledge on Disco, ASM, Esec, Datacon and other advanced die bonder/pre-assembly equipments

• Independent with good communication and coordination skills

• Demonstrate an ability to lead a team for complex problem-solving

• Good analytical thinking and high initiative to challenge him/herself to move to the next level of competency

• Ability to commit to frequent business travel to Batam and Malaysia 

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DISCLAIMER

The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

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We invite interested candidates to write-in with CV to Lee Shiow Chyn, EA 12C6130/ R1112042 semicon@hpspartners.com.sg 

 

We regret that only shortlisted candidates will be contacted for a discussion.