Lead technical efforts in package technology, define tasks for new package projects, covering design rule creation, DFMEA, delta assessment, and cost analysis.
Mentor design engineers in design, conceptual drawings and defining parameters.
Serve as a technical expert in package reliability during the definition stage, emphasizing the impact of design on customer reliability.
Act as a primary contact for package definition.
Contribute technical expertise through paper publications and active participation in the Asian international community.
PhD/Masters/Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with a minimum of 6 years’ experience in Semiconductor Back-End Assembly Development (R&D).
Demonstrated creative problem-solving and idea generation (IP) skills.
Strong communication and presentation abilities.
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.
Lee Shiow Chyn