Defines IC Package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements. Develops SSD assembly processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Develops new SMT process qualification programs. Plans and conducts experiments to fully characterize processes throughout pathfinding to development to ramp. Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools. Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up. Acts as a liaison with suppliers/vendors. Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production. Using appropriate tools, performs integrity analysis of packages.
Specific Role Description: Includes the following but not limited to:
SMT process development
SMT integration development
SMT technology (equipment/process/metrology) pathfinding
Stencil design/development for new components
Factory emergency taskforce support
Special engineering projects
BS engineering/science required plus >10 years of relevant work experience. Relevant work experience must be in engineering management role within electronic manufacturing industry. Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence.
Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of the point of diminishing returns.
Proficient in statistical analysis towards problem solving and the use of Excel and JMP.
Demonstrated track record to summarize complex data sets for technical and non-technical audiences; elegant in DOE design and execution.
Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition.
Proven success leading technical team(s) in previous work experience.
Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques).
Strong verbal and written communications skills.
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.
Lee Shiow Chyn