Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 – Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.