Resonac Plans to Establish Semiconductor Back End Process R&D Center in Silicon Valley

Today, Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac") announces that it plans to establish a research and development center for semiconductor packaging technologies and semiconductor materials in Silicon Valley, California, the USA. Resonac has started to investigate, select, and prepare facilities to be installed in the new R&D center.

While the global semiconductor market is projected to exceed US$1 trillion by 2030, the evolution of AI technologies, including Generative AI which has been rapidly expanding throughout this year, is accelerating. Many cutting-edge semiconductor technologies supporting this trend have originated from Silicon Valley, where prominent US semiconductor manufacturers, such as Intel and NVIDIA, are concentrated. Additionally, in recent years, GAFAM*, which deploy cloud services including Generative AI services, are known to develop AI semiconductors optimized for their own services.