TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States

HSINCHU, Taiwan & TEMPE, Ariz.--(BUSINESS WIRE)--Jun. 16, 2026-- Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) today announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.