TSMC to build 2 advanced IC packaging plants in Chiayi

Taipei, March 18 (CNA) Vice Premier Cheng Wen-tsan (鄭文燦) announced on Monday that contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) will build two advanced IC packaging plants in Chiayi County, southern Taiwan.

Cheng made the announcement during a trip to Chiayi accompanied by TSMC Vice President for operations and facility Arthur Chuang (莊子壽), and other ranking government officials including Economics Minister Wang Mei-hua (王美花), adding that the first IC packaging plant using the sophisticated Chip on Wafer on Substrate (CoWoS) technology in Chiayi is scheduled to break ground in May.