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Product Integration Program Manager

  • Yield enhancement and process capability program management

  • Lead initiatives for next generation engineering data analysis (EDA), including Industry 4.0/smart manufacturing, and AI/machine learning applications

  • Enhance and optimize EDA systems for Yield and Defect Management platforms

  • Work with Technology Development, Production Engineering, Quality and Application Engineering teams to mitigate technology and manufacturing risks

  • Work with internal stakeholders and external parties/vendors to execute projects, utilizing project management best practices

  • Drive cross functional collaboration with global teams in a matrix organization

  • Perform any ad-hoc job scope as assigned by superior


  • PhD/Masters/Bachelor’s in Engineering/Physics/Materials Science or any equivalent discipline

  • 10+ years of experience with a progressive track record in the semiconductor and wafer fabrication industry

  • Background in technology transfer, process optimization, yield and defect metrology programs

  • Expertise in the semiconductor manufacturing systems, including EDA, yield learning and process controls

  • Experience leading and developing high performance teams

  • Expertise in statistical methods, including Lean and Six Sigma applying SPC & DOE

  • Project/program management experience (PMP is a plus)


The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV to Lee Shiow Chyn, EA 12C6130/ R1112042 

We regret that only shortlisted candidates will be contacted for a discussion.

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