Head of Packaging Platform - Intelligent Power Module
The backend segments enable the development of comprehensive innovation across the entire value chain: starting with chip manufacturing, to wafer testing, preassembly, package development and development of new materials. The backend cluster combines the competencies for planning, productivity, innovation and quality, assembly and testing.
In your new role you will:
Lead the package R&D of Intelligent Power Module (IPM) with activities in Singapore and Korea
Define and implement the platform strategy which aligned to operation and business divisions objectives
Be the central point of contact for IPM R&D team in Singapore and Korea regarding project setup and execution, pipeline management, budget alignment, KPI topics
Plan, monitor and control the IPM packaging budget and headcount planning for successful project delivery and sustainable financial performance
Represent the IPM package team, close interface with Industrial Power Control business division from multiple locations on package development roadmap, strategy and execution
Close collaboration with partners in operation for new product introduction, productivity, quality and stability
Develop the team to greater competency and sustainable performance in package development
You remain focused on the big picture even in complex situations and are willing to take ownership even in uncertain circumstances. You are an inspiring member within your team and enjoy working hands-on to succeed. You demonstrate excellent communication skills and know how to establish sustainable relationships and networks.
PhD / Master's / Bachelor's in Engineering / Science & Technology with minimum 10 years of experience in semiconductor industry
A specialist in Power package assembly and development and a project manager with experience in project management methods and processes, provided in project frameworks like IPMA C / PMP
Profound understanding of Semiconductor operation, R&D and supply chain model
Strong knowledge on technology road mapping and realization
Demonstrate strong leadership skill especially in a cross-functional and cross-cultural organization
Good finance knowledge on department planning and controlling, with understanding in technical and cost interrelations
Good overview of competitor and industry trend and familiar with intellectual property process
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV in MS Word format to Lee Shiow Chyn, EA 12C6130/ R1112042 Technology@hpspartners.com.sg. We regret that only shortlisted candidates will be contacted for a discussion.