Senior Staff Engineer - Package Simulation

HPS Partners is sourcing for a key contributor for an MNC in Singapore and invite interested applications to write in with CV to  


  • Participate in new package development by modelling new design concepts and simulating different loading scenarios (e.g. Thermal, Thermomechanical, Mechanical and Moisture-Induced Loadings)

  • Identify early risks with respect to Functionality, Manufacturability and Reliability

  • Act as a problem solver by finding physics-based explanations to customers’ problems and suggesting appropriate countermeasures

  • Recommend and suggest design / process improvements to enhance the package robustness

  • Provide technical guidance & coaching to junior colleagues through knowledge sharing and comprehensive documentation

  • Drive the continuous development of leading edge simulation approaches & advanced material modelling to enhance simulation accuracy and efficiency; ability to identify and leverage on the resources and expertise of research institutions for such studies / projects if appropriate

  • Lead / explore / implement the integration of Artificial Intelligent / Machine Learning approach to conventional package simulation tools


  • You are best equipped for this task if you have:

  • Master’s / PhD Degree in Mechanical Engineering / Material Science / Mathematics / Physics with minimum 3 years of relevant professional experience in Semiconductor industry

  • Highly proficient with Finite Element Modeling (FEM) tools such as ANSYS

  • Strong familiarity with various types of IC packaging methods and assembly processes including die attach, molding, mold ejection and trim / form

  • Thorough understanding of typical loading / testing conditions and the corresponding failure modes for IC packages

  • Experience with Material Characterization & Modelling (e.g., viscoelastic / creep, cohesive zone and failure models) and 3D CAD modeling tools will be an advantage

  • Strong analytical thinking with excellent communication skills

  • Background and experience in AI / MC usage in product development process

  • Experience in optimization tool usage in FEM environment


The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We regret that only shortlisted candidates will be contacted for a discussion.

EA 12C6130 R1112042 

Lee Shiow Chyn