Staff/ Senior Staff Engineer Package Technology

In your new role you will:

  • Conduct technical feasibility of new package design and make recommendations to address delta

  • Assess compliance to BD, DR, BOM, and PBC to already established guidelines

  • Collaborate with designer, characterization and material team to initiate required analysis to address gaps identified

  • Quantify the potential impact of new technology implementations on overall package cost and make recommendations to achieve cost targets

  • Reduce complexities in processes by reviewing and harmonizing BOM,PBC, and DR.

  • Provide technical support to project managers during new package technology qualifications and technical risk assessments (DFMEA and PFMEA) and ensure timely and effective solutions are deployed to identified risks.

  • Support strategic cost improvement and next level of productivity programs.

 

You are best equipped for this task if you have:

  • Master's/ Bachelor's Degree in Chemical/ Electrical/ Mechanical/Materials Engineering

  • Min 5 years in Package Development/ NPI/ Process Assembly in a matrix organization, exposure to IPM highly desirable

  • Understands FE-BE, chip-package, assembly materials-processes interactions

  • Proficient in APQP, DOE, FMEA, and Six Sigma

  • Knowledge in DR, BD, BOM, and equipment capability

  • Knowledge in failure mechanism and failure analysis of assembly and test-related defects

DISCLAIMER

The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV to Lee Shiow Chyn, EA 12C6130/ R1112042 semicon@hpspartners.com.sg 

 

We regret that only shortlisted candidates will be contacted for a discussion.