Wafer Bonding Staff/ Senior Engineer
HPS Partners is sourcing for a key contributor for an MNC in Singapore and invite interested applications to write in with CV to email@example.com
Principal focus on developing and transferring of new wafer finishing processes/technology.
Responsible for wafer temporary bonding processes like such as curing bonding, thermal and mechanical bonding, lamination and the debonding methodology etc.
Actively drive process development, inclusive of process/product characterization, qualification and production pilot runs and volume ramp, through the matrix-management of a cross-functional team within the Singapore Operations, to achieve timely delivery of quality innovations and products to meet market and customer demands.
Introduce new products, processes and technologies within customer requirements, with the objective of ensuring process robustness and manufacturability, cost effectiveness and profitable yields, complete with post-release care.
Plan and perform experiments in collaboration with international design team, vendors, etc.
Establishing good process margins and inline controls including setting up SPC control chart as well as maintenance of Cp/Cpk performance
Perform routine reporting of project status as well as creating & updating of process
documentations, i.e FMEA, Operating Instructions, Process Characterization Report, Control Plan, etc.
Yield analysis and lead trouble-shooting of defect and yield issues and process excursions associated with the new process/tools.
Bachelor's Degree in Engineering, Physics or Chemistry.
Minimum 3 years of experience in semiconductor environment , with direct experience in any/all of the following areas: technology transfer, process integration, yield engineering, unit/module process development, statistical process control.
SPC, DOE, FMEA, lean methodology, various analysis techniques, minitab , JMP
It will be an advantage if candidate also has experience on at least one of the following processes : wafer thinning, wafer dicing (stealth dicing, laser ablation, mechanical dicing, filamentation laser and other new dicing methods), wafer breaking, tape transfer, PnP, ULED mass transfer techniques etc.
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We regret that only shortlisted candidates will be contacted for a discussion.
EA 12C6130 R1112042
Lee Shiow Chyn