Manage and lead an equipment engineering and sustaining group to meet Module goals by optimizing equipment available time, cost, and quality.
Forecast and budget on equipment upkeep cost and any other related expenditures.
Drive improvement activities – Reduce equipment upkeep costs, prevent excursions, minimize wafer scraps, and improve process capability etc.
Develop system/procedure to ensure first time success in PM, effective troubleshooting that result in low MTTR and spare cost.
Set expectation and accountability to each employee on understanding and compliance to MRB, TECN, 8D specification requirements.
Regular assessment on risk management with action items identified.
Develop internal audit system in compliance to TS16949 and customer requirements.
Project monitoring system in place to keep track of project status and progress vs fab performance requirements.
Establish / monitor vendor performance metrics to drive quality and cost improvements.
Perform appraisals, map career path for subordinates, and develop key staff for success planning.
Degree or Master's Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering.
Minimum 8 years of experience in Semiconductor industry.
Strong Clean Tech / Wet Etch equipment tool knowledge.
Familiar with TS16949, FMEA, SPC.
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.
Lee Shiow Chyn