SHANGHAI, April 23 (Reuters) - German automaker BMW (BMWG.DE), opens new tab plans to start integrating artificial intelligence from Chinese startup DeepSeek in its new models in China from later this year, CEO Oliver Zipse said at the Shanghai auto show on Wednesday.

Export orders last month rose 12.5 percent from a year earlier to US$5.88 billion, reaching a five-month high, while also increasing 12.1 percent to US$149.47 billion in the first quarter from a year earlier, the Ministry of Economic Affairs reported yesterday.

On a monthly basis, export orders last month increased 7.3 percent, which the ministry attributed to increases in orders for information and communications technology (ICT), and electronic and optoelectronic products, despite declines in orders of base metal, plastic, rubber and chemical products.

Hon Hai Precision Industry Co (鴻海精密) has agreed to produce a new electric vehicle (EV) model for Mitsubishi Motors Corp of Japan, a source within the industry said on Sunday.

Hon Hai, also known as Foxconn Technology Group (富士康科技集團), would start initial production of the new EV model at a plant in Miaoli County owned by its partner Yulon Motor Co (裕隆汽車), said the source, who spoke on condition of anonymity.

The vehicle would be a modified version of Hon Hai’s Model B prototype, first unveiled in 2022, the source said, without giving a date for the expected start of production.

Ceribell has created an EEG platform for patients in several care settings. Combining a disposable, flexible headband and pocket-sized, battery-operated recorder, the system captures and wirelessly transmits EEG signals. An algorithm continuously monitors the EEG signal. The technology is designed to make it viable for more facilities to continuously monitor patients and cut the time taken to detect seizures.

SAN FRANCISCO, April 17 (Reuters) - Intel's (INTC.O), opens new tab new CEO, Lip-Bu Tan, is flattening the semiconductor giant's leadership team, with important chip groups reporting directly to him, according to a memo from Tan seen by Reuters.
Intel has also promoted networking chip chief Sachin Katti to be chief technology officer and artificial intelligence chief, according to the memo.

Taiwan will prioritize the development of silicon photonics by taking advantage of its strength in the semiconductor industry to build another shield to protect the local economy, National Development Council (NDC) Minister Paul Liu (劉鏡清) said yesterday.

Speaking at a meeting of the legislature’s Economics Committee, Liu said Taiwan already has the artificial intelligence (AI) industry as a shield, after the semiconductor industry, to safeguard the country, and is looking at new unique fields to build more economic shields.

TAIPEI – Taiwan Semiconductor Manufacturing Company (TSMC) gave a bullish outlook for the year on robust demand for AI applications, adding that while there was uncertainty over US tariffs, the world’s largest contract chip manufacturer had yet to see any change in customer behaviour.

The Taiwanese company, a bellwether for the global chip industry, stood by its annual outlook for sales and capital spending on April 17 and forecast artificial intelligence (AI) chip revenue to double.

During the Economic Ministers’ Meeting and the Industrial Competitiveness Enhancement Ministers’ Meeting on April 15, Vice Prime Minister and Minister of Economy and Finance Choi Sang-mok announced a substantial financial initiative aimed at bolstering South Korea’s semiconductor industry.

The government introduced a 50 trillion won (approximately $34.4 billion) Advanced Strategic Industry Fund, set to invest over 20 trillion won in the semiconductor sector starting this year. This marks an increase of 3 trillion won from previously announced plans. The move comes amid heightened uncertainties in global trade dynamics, particularly due to U.S.-initiated tariff wars.

SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry.

Applied and Besi have been successfully collaborating since 2020, and recently extended their agreement, to co-develop the industry’s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is becoming a critical technology for advanced packaging of semiconductors as designers and manufacturers race to develop more energy-efficient chips. Hybrid bonding connects chips using direct copper-to-copper bonds, which increases density and shortens the lengths of interconnect wiring between chiplets, resulting in improved overall performance, power consumption and cost.

SCOTTSDALE, Ariz. – April 14, 2025 – onsemi (NASDAQ: ON) today announced that it has terminated its efforts to acquire Allegro MicroSystems, Inc. (“Allegro”) (NASDAQ: ALGM) and withdrawn its all-cash proposal to acquire Allegro for $35.10 per share.

While onsemi continues to believe that a combination of these companies would have brought two highly complementary businesses together, benefiting their respective customers and delivering immediate value to Allegro shareholders, onsemi has determined there is no actionable path forward.