MALTA, N.Y., Oct. 8, 2026 – GlobalFoundries (Nasdaq: GFS) (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS® advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems. The agreement provides a foundation to expand capacity over time as customer demand grows.

PENANG – Just south of Penang, the historic trading island off Malaysia’s north-west coast, excavators are turning a stretch of blue-green sea into a new, man-made island. Dump trucks criss-cross freshly reclaimed sand as orange pipes snake across the emerging land mass, carrying fill pumped from dredgers offshore.

Once complete sometime next decade, this 930ha area, called Silicon Island, is expected to entrench Malaysia’s role in the global semiconductor industry, adding hundreds of billions of dollars to its economy and creating some 220,000 jobs by 2050.

Huawei and Qualcomm today announced a multi-year, broad patent license agreement that includes cross licenses to the companies’ patent portfolios across a range of technology fields, including 5G, compute, AI, and networking, together with Qualcomm’s purchase of certain Huawei U.S. patents in the areas of compute, AI, networking, and other technologies. This transaction will close following receipt of the necessary regulatory approvals. The agreement reflects the companies' shared commitment to intellectual property rights and to licensing practices consistent with fair, reasonable and non-discriminatory (FRAND) principles.

NEWS – Erfurt, Germany – Oct 05, 2026 –– Today, X-FAB was joined by representatives from government, industry, and academia to break ground on a new cleanroom at its Erfurt site. Through the Fab4Micro project, X-FAB MEMS Foundry GmbH is expanding its manufacturing capacity for highly integrated microsystems and photonics, thereby continuing the transition of the Erfurt site into X-FAB Group’s microsystems hub.

The new facility is intended to support growing demand from the automotive, industrial, and medical end markets while also making an important contribution to strengthening Europe’s sovereignty in semiconductor technology.

Bangkok, Thailand, 01 October 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) officially inaugurated its new backend manufacturing site in Bangkok, Samut Prakan, together with Anutin Charnvirakul, Prime Minister of Thailand and Alexander Gorski, Chief Operations Officer of Infineon Technologies. The site strengthens and further diversifies the company's global manufacturing footprint while adding capacity for future growth. Strategically located in the heart of Southeast Asia, the site reinforces Infineon's ability to serve customers worldwide at a time when long-term semiconductor demand continues to grow, driven by digitalization, electrification and the energy transition.

Tokyo - September 30, 2026 - TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), has recently established a production site for Flip Chip Ball Grid Array　(FC-BGA) substrates, high-density semiconductor packages, at ADVANCED SUBSTRATE TECHNOLOGIES PTE., LTD. (AST) in the Republic of Singapore.

This plant marks TOPPAN’s first overseas production facility for FC-BGA substrates, supported by the Singapore Economic Development Board (EDB) and BROADCOM Inc., a leading provider of semiconductors for telecommunications. A ceremony to mark the opening was held on September 29.

ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about NT$2.152 billion. The site is intended to support future capacity expansion.

SINGAPORE: Semiconductor industry players have committed more than S$500 million (US$390 million) to research and development projects in Singapore over five years from 2026.

This exceeds the more than S$400 million spent on such efforts between 2020 and 2025, according to the Agency for Science, Technology and Research (A*STAR).

Singapore, September 28, 2026 – VisionPower Semiconductor Manufacturing Company Pte. Ltd. (VSMC), the joint venture established in September 2024 by Vanguard International Semiconductor Corporation (VIS, TPEx: 5347) and NXP Semiconductors N.V. (NXP, NASDAQ: NXPI), today marked the grand opening of its first 12-inch (300mm) fab in Tampines, Singapore.
The fab adopts a fully automated smart manufacturing model, integrating artificial intelligence and digital management technologies to continuously enhance operational efficiency and customer service quality.

SINGAPORE – SG Semiconductor is now the national brand identity of Singapore’s chip industry, a move aimed at enhancing global visibility of its strength and status.

The first dedicated national brand for the sector was jointly developed by the Republic’s lead science agency, A*STAR, and investment promoter Singapore Economic Development Board (EDB). Announced on Sept 25 by Minister for Trade and Industry (Energy and Industry) Tan See Leng, SG Semiconductor will make it easier for companies and talent to understand what the country and its chip ecosystem offer.