Munich, Germany and Kyoto, Japan – 25 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and ROHM Co., Ltd. (TSE: 6963) have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems and AI data centers. Specifically, the partners aim to enable each other as second sources of selected packages for SiC power devices, a move which will increase design and procurement flexibility for their customers. In the future, customers will be able to source devices with compatible housings from both Infineon and ROHM. The collaboration will ensure seamless compatibility and interchangeability to match specific customer needs.

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is to start building a new 1.4-nanometer fab next quarter with an anticipated production value of up to NT$500 billion (US$16.49 billion), the Central Taiwan Science Park Bureau said yesterday.

TSMC, the world’s biggest contract chipmaker, is working at full steam to push forward the construction of its new factories at home, rather than taking a slower approach as some media speculated, bureau Director-General Hsu Maw-shin (許茂新) said.

The STARLight project brings together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics (SiPho) technology by establishing a high-volume manufacturing line, developing leading-edge optical modules, and fostering a complete value chain. From now until 2028, STARLight aims to develop application-driven solutions focusing on key industry sectors such as datacenters, AI clusters, telecommunications, and automotive markets.

Led by STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the STARLight consortium has been selected by the European Commission under the EU CHIPS Joint Undertaking initiative.

Mercedes-Benz AG and UKA Group have received clearance to begin construction of a 140-megawatt wind farm on the automaker’s 800-hectare test track in northern Germany. Scheduled for completion in 2027, the facility will comprise 20 turbines and supply roughly one-fifth of Mercedes-Benz’s electricity needs in Germany under a long-term power purchase agreement (PPA).

The project marks a significant investment in onshore wind at a time when Germany is accelerating renewable deployment to cut dependence on fossil fuels and meet EU energy transition targets.

Chinese car giant BYD has broken landmark world speed records for the second time in a month.

Last month, BYD broke the world top speed record for EVs at over 472 km/hr with its first electric supercar, the two-door U9 Track Edition test vehicle, under its Yangwang luxury brand.

Now, the company has unveiled its Track Edition variant, the Yangwang U9 Xtreme, which has toppled the previous speed record of any production car, reaching 496 km/h, outdoing famous ICE models from hypercar manufacturer Bugatti.

Stellantis unveiled an electric vehicle prototype on Friday featuring a faster-charging, lighter and more affordable battery that eliminates the need for a separate inverter and charger.

The IBIS (Intelligent Battery Integrated System) was developed in partnership with TotalEnergies (TTEF.PA), opens new tab subsidiary Saft. It is one of the first of its kind and provides weight and space savings and is easier to service, Stellantis said.

On September 12, Japan’s Ministry of Economy, Trade and Industry announced a subsidy of up to JPY 536 billion for Micron’s DRAM plant in Hiroshima, supporting new construction, production, and R&D with a focus on high-bandwidth memory and EUV lithography. Micron plans to invest around JPY 1.5 trillion at the site, targeting mass production of 1-gamma process DRAM chips by 2027. The move underscores Japan’s strategy of strengthening domestic semiconductor capabilities while attracting foreign investment, following earlier subsidies to Micron in 2022 and 2023. It comes as Japan also backs TSMC’s expansion, with the chipmaker building two fabs in Kumamoto, the first set to begin production by the end of 2024 and the second dedicated to 6nm chips.

Sept 18 (Reuters) - Panasonic (6752.T), opens new tab aims to develop a new type of higher-capacity battery in about two years, potentially extending the driving range of electric vehicles in a groundbreaking advance for the Tesla (TSLA.O), opens new tab supplier.

The Japanese company is working on eliminating the anode in batteries during the manufacturing stage to increase energy density through technology it says is likely to provide a "world-leading level" of capacity by the end of 2027.

NVIDIA (NASDAQ: NVDA) and Intel (NASDAQ: INTC) announced a wide-ranging partnership to co-develop custom data center and PC products that integrate NVIDIA’s AI and accelerated computing with Intel’s CPUs and x86 ecosystem. The collaboration will leverage NVIDIA’s NVLink technology to connect the companies’ architectures, with Intel set to build custom x86 CPUs for NVIDIA’s AI infrastructure platforms and new x86 system-on-chips featuring NVIDIA RTX GPU chiplets for PCs. Alongside the product collaboration, NVIDIA will invest $5 billion in Intel’s common stock at $23.28 per share, pending regulatory approvals.

BANGKOK,Thailand and MUNICH, Germany – 18 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has entered into a definitive agreement to transfer its backend manufacturing site in Bangkok/Nonthaburi Thailand, to Malaysian Pacific Industries Berhad (MPI), a trusted supplier of Infineon. Along with the transition, Infineon secures a long-term supply agreement with MPI. Additionally, both companies agreed to strengthen their partnership and to collaborate on the joint development of innovative package solutions.

This strategic step further enriches the local semiconductor ecosystem by bringing a new semiconductor company into the country. MPI is an investment holding company headquartered in Malaysia. Under the name Carsem, MPI’s subsidiaries are providing outsourced semiconductor assembly, packaging and testing services (OSAT) for its customers across the globe for already more than 50 years.