Job description
Lead the Wafer Thinning / Dicing Equipment section.
Implement preventive / predictive maintenance and productivity improvement program,
Driving Key Performance Indices (KPIs) through continuous improvement projects and cost reduction efforts.
Define equipment capabilities, strategies and roadmap.
Work with respective teams and suppliers on new products.
Requirements
Bachelor / Master in Mechanical, Mechatronics, Electrical, Electronics Engineering or related disciple.
6 years of relevant semiconductor experience.
Knowledge in Wafer Thinning, Dicing / Laser Grooving.
Experience in FMEA, DOE, KT and Data Analysis.
Disclaimer
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.
Lee Shiow Chyn
EA12C6130
R1112042
hr@hpspartners.com.sg