Lead backend material innovation projects, with a specific focus on leadframe base material and finish process/composition.
Serve as a subject matter expert, addressing global challenges in backend packaging projects.
Contribute to the formulation and execution of the backend material innovation roadmap, from initial conceptualization to development.
Play a pivotal role in devising and implementing strategies within the realm of leadframes and surfaces, encompassing plating, leadframe processes, and wire bonding.
Actively contribute to the IP strategy, including the creation and promotion of intellectual property and innovation.
Collaborate cross-functionally with multiple departments to ensure seamless project implementation.
Profound technical expertise in semiconductor backend packaging, particularly in leadframe base material and finish.
Possess Master's or PhD in Chemistry, Material Science, Engineering, or a related discipline with a minimum of 10 years of relevant work experience, including backend semiconductor processes, leadframe processes, and metals.
Exceptional presentation skills coupled with outstanding networking abilities.
Excellent English communication skills, facilitating collaboration within a diverse cross-functional culture.
Willingness to engage in occasional business travel (5-10%)
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.
Lee Shiow Chyn