Manage and develop Team
Identify headcount needs, recruit, interview and make hiring decisions
Coach and provide career development, identify strengths and create specific development plans for each direct report
Establish goals, conduct performance appraisals, provide recognition and drive accountability
Develop and provide technical training to team and groom each member to realize his/her fullest potential
Manage NPI Projects
Liaise with APTD, Package design, PE, Test, Process, QRA team on NPI project schedule for Die Bond and Wire Bond Operation
Understand technical risk and able to push technical envelope whenever possible to design packaging solution that is processable, optimizing quality vs cost and cycle time.
Perform Technical Risk Assessment on NPI projects. Plan materials, process and equipment selection to mitigate risk. Plan Checkout and FUT to validate process are good to support qualification build
Perform design, process and material optimizations to ensure robust NPI introduction
Schedule 1st Si, engineering samples and qualification build. Plan resources to ensure smooth execution
Resolve technical challenges and perform root cause analysis on any quality and reliability issues encountered during the various builds
Drive technical development of the engineers
Maintain the product realization workflow and documents checkout, FUT, qualification reports to meet TS certification
Work with Technology Development team to understand new technology challenges and adapt technology to support new product NPI
Understand the TD POR, TOR and BOM and adapt or make necessary changes to support NPI
Document lessons learnt from NPI start-up. Define NPI POR, TOR and BOM to support fan-out to HVM
Work with planning, capacity and production to hand hold the first LVM production and ensure smooth transfer into HVM
Ensure a smooth ramp-up without quality issue related to product, met all the HVM metrics goal during LVM
Bachelor’s Degree in Engineering
Minimum 2-3 years managerial experience in Backend Semiconductor Manufacturing, experienced in leading NPI qual success and sample on time delivery. Equipped with advance package know-how (process engineering or material engineering know-how)
Good knowledge of data analysis, process characterization, problem solving and management skill.
Knowledgeable in IC Packaging Assembly Process Flow.
Independent with good communication and co-ordination skills.
Great team work within the team and cross functional team
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.
Lee Shiow Chyn