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Process Engineering Manager (Die Attach and Wire Bond)


Job Type

Full Time, Permanent

Work Mode


Job description

  • Implement process and equipment modifications to improve production efficiencies, yield and SPC.

  • Role model and lead the team in driving structured and consistent problem solving methodology.

  • Lead engineering improvement activities for the factory.

  • Drive and influence BU and stakeholders in making right decision for the factory without impacting factory operations.


  • Bachelor / Master in Mechanical, Mechatronics, Electrical, Electronics Engineering or related disciple.

  • 6 years of relevant semiconductor process experience.

  • Knowledge in Die Attach / Wire Bond.

  • Experience in FMEA, SPC, DOE, KT, Material Properties / Package Analysis.


The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.

Lee Shiow Chyn

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