Job description
Implement process and equipment modifications to improve production efficiencies, yield and SPC.
Role model and lead the team in driving structured and consistent problem solving methodology.
Lead engineering improvement activities for the factory.
Drive and influence BU and stakeholders in making right decision for the factory without impacting factory operations.
Requirements
Bachelor / Master in Mechanical, Mechatronics, Electrical, Electronics Engineering or related disciple.
6 years of relevant semiconductor process experience.
Knowledge in Wafer Thinning / Wafer Dicing.
Experience in FMEA, SPC, DOE, KT, Material Properties / Package Analysis.
Disclaimer
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.
Lee Shiow Chyn
EA12C6130
R1112042
hr@hpspartners.com.sg