Job description
Seeking a senior engineering professional to lead innovation in semiconductor manufacturing. The role focuses on developing and improving products and systems in areas such as thermal solutions, advanced packaging, wafer-level testing, and test equipment. The candidate will drive cross-disciplinary innovation from concept to commercialization.
Key Responsibilities
Lead design and enhancement of new semiconductor products or systems.
Manage innovation from ideation to market launch through structured reviews and reports.
Identify new technology and business opportunities based on market and customer insights.
Collaborate with internal teams and partners to execute product marketing and commercialization.
Support budgeting and continuous improvement of innovation processes.
Requirements
Degree in Engineering, Science, or related field with 10+ years’ relevant experience, preferably in semiconductors.
Expertise in thermal systems, advanced packaging, wafer/final testing, or test equipment.
Strong design background in mechanical or electrical/electronic systems; test equipment experience preferred.
Understanding of semiconductor technology trends and advanced packaging.
Proven record in product innovation; IP or patent experience is a plus.
Strong analytical, creative, and communication skills; international exposure preferred.
Willing to travel and perform effectively in dynamic environments.
Disclaimer
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.
Lee Shiow Chyn
EA12C6130
R1112042
hr@hpspartners.com.sg