Job description
Leads the go-to-market strategy for advanced thermal-interface and packaging materials, expanding design-ins with substrate makers, OSATs and IDMs.Â
Key responsibilities
Formulate regional sales & marketing plans, pricing and revenue forecasts.
Drive technical engagements from evaluation through mass-production qualification.
Coordinate NPI schedules between local customers and manufacturing plants; represent the firm at SEMICON, IMAPS and similar forums.
Recruit, mentor and performance-manage a growth-oriented sales team.
Requirements
STEM degree in Materials, EE, Applied Chemistry or similar.
10 + years in electronic-materials / advanced-packaging sales with ≥5 years at director level.
Deep knowledge of TIMs, heat-management and flip-chip/AI-accelerator packaging.
Fluent in Mandarin & English.
Willing to travel.
Disclaimer
The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
We invite interested candidates to write-in with CV and regret that only shortlisted candidates will be contacted for a discussion.
Lee Shiow Chyn
EA12C6130
R1112042
hr@hpspartners.com.sg