Intel Invests $300M to Expand Chengdu Facility for Server Chip Packaging

Intel announced today an expansion of its packaging and testing facility in Chengdu, China. In addition to packaging and testing for client products, the facility will now offer services for server chips and will establish a Customer Solutions Center aimed at boosting local supply chain efficiency, enhancing support for Chinese clients, and improving response times. Planning and construction for these enhancements are already underway.