ASE to expand advanced chip packaging in Kaohsiung

TAIPEI (Taiwan News) — Advanced Semiconductor Engineering Inc. (ASE) CEO Wu Tien-yu (吳田玉) announced Tuesday that the company plans to establish Taiwan’s first large-scale 600x600 fan-out panel-level packaging (FOPLP) production line in Kaohsiung.

With an investment of US$200 million (NT$6.55 billion), ASE plans to install equipment in the second quarter and begin trial runs in the third quarter, per CNA. The company will assess yield rates and quality by year-end to determine commercial viability.