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Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility

By U.S. Department of Commerce

6 Jan 2025

Facility is expected to host the world’s first 300mm front-end semiconductor manufacturing and advanced packaging research facility

60 Paya Lebar Road #07 - 54
Paya Lebar Square

Singapore 409051

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