Chipmaker Frencken to build new $63 million plant in Kaki Bukit

SINGAPORE - Singapore mainboard-listed semiconductor maker Frencken will invest $63 million to build a new and larger five-storey manufacturing facility in Kaki Bukit.

The new site will be built on a plot of land leased by JTC Corporation to its subsidiary ETLA for a period of 33 years, from Aug 18, 2025, the group said in a bourse filing on June 3.

The new facility will “lay a stronger foundation” for the company to continue to expand its mechatronics business in Singapore, and will expand its production resources to support existing and new programmes, as well as strengthen its position with key customers in the coming years, it added.