CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program

BALTIMORE — Today, the Biden-Harris administration announced its vision to boost U.S. capabilities for advanced packaging, a key technology for manufacturing state-of-the-art semiconductors. In remarks at Morgan State University, Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio laid out how the U.S. will benefit from the Department of Commerce CHIPS for America program’s manufacturing incentives and research and development efforts. In particular, approximately $3 billion in funding for the National Advanced Packaging Manufacturing Program will be used to drive U.S. leadership in advanced packaging. An initial funding opportunity for this program is expected to be announced in early 2024. Supporting innovation and keeping the U.S. at the forefront of new research is a critical part of the president’s Investing in America agenda.