Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High-NA EUV

This week at the SPIE Photomask Technology + Extreme Ultraviolet Lithography conference, Intel Foundry and ASML highlighted continued progress in bringing High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography into production and advancing the technologies that will shape its future adoption.

Intel Foundry and ASML are building on years of collaboration to bring together the lithography ecosystem around larger-format masks, helping drive standards, infrastructure, and technology advances needed to support future High NA EUV scaling. Working alongside mask makers, automation suppliers, EDA partners, materials providers, and semiconductor manufacturers, the companies have helped establish the industry's path to larger-format masks while enabling customers to realize the benefits of High NA EUV today.