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Japan's Toppan to build Singapore chip package substrate plant

By Nikkei Asia

14 Mar 2024

TOKYO -- Toppan Holdings plans to build a semiconductor package substrate plant in Singapore and begin operations at the end of 2026, joining several other Japanese substrate makers in boosting capital investment amid booming demand tied to artificial intelligence.

60 Paya Lebar Road #07 - 54
Paya Lebar Square

Singapore 409051

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