top of page

Micron Breaks Ground on Advanced Wafer Fabrication Facility in Singapore

By Micron Press

27 Jan 2026

SINGAPORE, Jan. 27, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on an advanced wafer fabrication facility located within the company's existing NAND manufacturing complex in Singapore. This new facility represents a planned investment of approximately US $24 billion (SG $31 billion) over 10 years and is designed to ultimately provide 700,000 square feet of cleanroom space. Wafer output is scheduled to begin in the second half of calendar 2028, helping Micron address growing market demand for NAND technology driven by the rapid expansion of AI and data-centric applications.

60 Paya Lebar Road #07 - 54
Paya Lebar Square

Singapore 409051

  • LinkedIn

© 2025 by HPS Partners. Powered and secured by Wix

bottom of page