NXP Semiconductors Breaks Ground on Assembly and Test Site Expansion in Malaysia

Petaling Jaya, Malaysia, August 12, 2026 – NXP Semiconductors N.V. (NASDAQ: NXPI) today celebrated the groundbreaking of its new assembly and test (A&T) factory in Petaling Jaya, Malaysia, an expansion of the company’s existing A&T site. The facility will further strengthen NXP’s global manufacturing footprint and increase internal capacity to support greater supply chain resilience and flexibility.

The groundbreaking ceremony brought together government officials, partners and NXP executives and team members to commemorate the start of construction. NXP was also honored to have the Honorable Gobind Singh Deo, Minister of Digital, Malaysia and His Excellency Jacques Werner, Ambassador of the Kingdom of the Netherlands to Malaysia, speak at the ceremony.