Samsung Reportedly Plans $170M Chip Packaging R&D Center in Yokohama, Opening Mar. 2027

According to The Korea Economic Daily, sources indicate that Samsung Electronics will invest 25 billion yen (about $170 million) to establish an advanced chip packaging research and development center in Yokohama, Japan. The report adds that the City of Yokohama, which announced Samsung’s R&D center plan in December 2023, will offer a 2.5 billion yen subsidy to support the lab’s launch.

As the report points out, Samsung plans to open the research lab in March 2027, aiming to strengthen partnerships with Japanese semiconductor material and equipment makers—such as Disco Corp., Namics Corp., and Rasonac Corp.—alongside the University of Tokyo. Samsung plans to hire University of Tokyo researchers to strengthen its packaging R&D in Yokohama, the report adds.