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Siemens and Intel to Collaborate on Advanced Semiconductor Manufacturing

By Intel Press Release

4 Dec 2023

SANTA CLARA, Calif., and MUNICH, Dec. 4, 2023 – Siemens AG, a leading technology company, and Intel Corporation, one of the world’s largest semiconductor companies, have signed a memorandum of understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.

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