Siemens and Intel to Collaborate on Advanced Semiconductor Manufacturing

SANTA CLARA, Calif., and MUNICH, Dec. 4, 2023 – Siemens AG, a leading technology company, and Intel Corporation, one of the world’s largest semiconductor companies, have signed a memorandum of understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.