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Siltronic Ends Wafer Production For "Small Diameters"

By Siltronic Press

22 Mar 2024

Munich, March 22, 2024 – Siltronic AG (MDAX/TecDAX: WAF) plans to gradually cease production of polished and epitaxial small diameter wafers at its Burghausen site. The process, which excludes unpolished wafers, is set to be completed in the course of 2025.

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