SPIL breaks ground on advanced IC packaging, testing plant in Yunlin

Taipei, Aug. 12 (CNA) Siliconware Precision Industries Co. (SPIL) on Tuesday broke ground on a NT$100 billion (US$3.11 billion) Chip-on-Wafer-on-Substrate (CoWoS) plant in Yunlin County to package and test and artificial intelligence (AI) chips.

At a groundbreaking ceremony, SPIL Vice Chairman Chang Yen-chun (張衍均) said the 6-hectare site at Yunlin Technology Industrial Park in Douliu City will complement facilities the company has expanded in Taichung, Changhua, Yunlin and Tainan amid booming demand for AI.

Chang said the first phase of the Douliu plant is scheduled to begin operations in 2028 and the entire investment is expected to create 2,200 new jobs in Yunlin.