TSMC plans to open chip packaging plant in Arizona by 2029, executive says

SANTA CLARA, California, April 22 (Reuters) - Taiwan Semiconductor Manufacturing Co (2330.TW), opens new tab plans to open a chip packaging plant in Arizona by 2029, an executive ​told Reuters.
Modern artificial intelligence chips, such as those made by Nvidia (NVDA.O), opens new tab, ‌are not single chips but several chips glued together with advanced packaging technologies, a step that has become a supply bottleneck for Nvidia and others. In a January earnings call, TSMC said it ​was applying for permits to begin construction of its first advanced packaging ​plant in an existing Arizona facility, but did not give a ⁠timeline for when it will come online.