TSMC Reportedly Fast-Tracks U.S. Packaging Plants for 2H26 Construction, 2028 Production

Amid scrutiny over Washington’s 10% stake in Intel, TSMC is pressing ahead with its U.S. expansion. MoneyDJ reports that site prep is underway for its two advanced packaging plants (AP1, AP2) in Arizona, with construction set to begin in 2H26 and production by 2028.

The report also details TSMC’s plan for the two advanced packaging plants, adding that AP1 will focus on expanding SoIC (System-on-Integrated-Chips) and CoW (Chip on Wafer) technologies, while AP2 will specialize in CoPoS (Chip-on-Panel-on-Substrate) to meet local demand for AI and HPC chip packaging.

As Commercial Times previously reported, citing sources in the supply chain, TSMC’s U.S. facilities will initially center on SoIC (System-on-Integrated-Chips) and CoW (Chip-on-Wafer), while the back-end oS (on-Substrate) stage will be handled by Amkor.