TSMC to break ground on advanced fab in October

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is expected to start construction of its 1.4-nanometer chip manufacturing facilities at the Central Taiwan Science Park (CTSP, 中部科學園區) as early as October, the Chinese-language Liberty Times (the Taipei Times’ sister newspaper) reported yesterday, citing the park administration.

TSMC acquired land for the second phase of the park’s expansion in Taichung in June.

Large cement, construction and facility engineering companies in central Taiwan have reportedly been receiving bids for TSMC-related projects, the report said.