TSMC to build 9 new plants this year to boost global footprint

TAIPEI (Taiwan News) — TSMC plans to build nine new plants worldwide this year, including advanced process and advanced packaging facilities, to expand its global footprint.

The company said it also started construction on nine plants last year, most of which were advanced wafer fabs. The number rose from three in 2022 to six in 2024, reflecting growing demand for advanced process and packaging capacity, per Economic Daily News.

The company plans to expand its 3-nm wafer fab at the Southern Taiwan Science Park this year. It will also convert part of the 5-nm capacity at Fab 18 to 3-nm production to meet rising demand for high-performance computing devices and AI chips.