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TSMC to open Japan's most advanced semiconductor production facility in February - chip production begins in H2

By Tom's Hardware

1 Jan 2024

TSMC will host a formal opening ceremony for its first fab in Japan on February 24, 2024, new reports say. The semiconductor production facility will be capable of making chips using TSMC's N28 (28nm-class) technologies -- and will be the most advanced logic fab in the Land of the Rising Sun.

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