Winbond to expand Kaohsiung fab

Winbond Electronics Corp (華邦電) yesterday said it plans to start expanding its Kaohsiung fab next year to boost DRAM capacity as the artificial intelligence (AI) boom drives a memorychip supercycle.

Construction is scheduled to start in January, with pilot production set for the end of 2029, the company said.

The Module B fab would have an initial installed capacity of 10,000 12-inch wafers per month, with total capacity of 50,000 wafers per month, Winbond said.