
Industry News
21 Apr 2025
By Medtech Dive
Ceribell wins FDA nod for algorithm to detect pediatric seizures
Ceribell has created an EEG platform for patients in several care settings. Combining a disposable, flexible headband and pocket-sized, battery-operated recorder, the system captures and wirelessly transmits EEG signals. An algorithm continuously monitors the EEG signal. The technology is designed to make it viable for more facilities to continuously monitor patients and cut the time taken to detect seizures.
18 Apr 2025
By Reuters
Exclusive: Intel CEO Lip-Bu Tan flattens leadership structure, names new AI chief, memo says
SAN FRANCISCO, April 17 (Reuters) - Intel's (INTC.O), opens new tab new CEO, Lip-Bu Tan, is flattening the semiconductor giant's leadership team, with important chip groups reporting directly to him, according to a memo from Tan seen by Reuters.
Intel has also promoted networking chip chief Sachin Katti to be chief technology officer and artificial intelligence chief, according to the memo.
17 Apr 2025
By Taipei Times
Taiwan to focus on silicon photonics, build new economic shield
Taiwan will prioritize the development of silicon photonics by taking advantage of its strength in the semiconductor industry to build another shield to protect the local economy, National Development Council (NDC) Minister Paul Liu (劉鏡清) said yesterday.
Speaking at a meeting of the legislature’s Economics Committee, Liu said Taiwan already has the artificial intelligence (AI) industry as a shield, after the semiconductor industry, to safeguard the country, and is looking at new unique fields to build more economic shields.
17 Apr 2025
By The Straits Times
TSMC upbeat on outlook as robust AI demand offsets tariff uncertainty
TAIPEI – Taiwan Semiconductor Manufacturing Company (TSMC) gave a bullish outlook for the year on robust demand for AI applications, adding that while there was uncertainty over US tariffs, the world’s largest contract chip manufacturer had yet to see any change in customer behaviour.
The Taiwanese company, a bellwether for the global chip industry, stood by its annual outlook for sales and capital spending on April 17 and forecast artificial intelligence (AI) chip revenue to double.
15 Apr 2025
By OKIKA DEVICES
Okika Devices Completes Acquisition of Anadigm
Colorado Springs, April 15, 2025 -- Okika Devices Corporation (Okika), a leader in analog signal processing today announced it has completed the acquisition of Arizona-based Anadigm, Inc. (Anadigm). Okika will assume all products, operations and support and assist in advancing Anadigm’s Field Programmable Analog Array (FPAA) technology in the analog integrated circuit (IC) marketplace.
15 Apr 2025
By BusinessKorea
South Korea Unveils 50 Tril. Won Fund to Boost Semiconductor Industry
During the Economic Ministers’ Meeting and the Industrial Competitiveness Enhancement Ministers’ Meeting on April 15, Vice Prime Minister and Minister of Economy and Finance Choi Sang-mok announced a substantial financial initiative aimed at bolstering South Korea’s semiconductor industry.
The government introduced a 50 trillion won (approximately $34.4 billion) Advanced Strategic Industry Fund, set to invest over 20 trillion won in the semiconductor sector starting this year. This marks an increase of 3 trillion won from previously announced plans. The move comes amid heightened uncertainties in global trade dynamics, particularly due to U.S.-initiated tariff wars.
14 Apr 2025
By Applied Materials News
Applied Materials Announces a Strategic Investment in BE Semiconductor Industries
SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry.
Applied and Besi have been successfully collaborating since 2020, and recently extended their agreement, to co-develop the industry’s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is becoming a critical technology for advanced packaging of semiconductors as designers and manufacturers race to develop more energy-efficient chips. Hybrid bonding connects chips using direct copper-to-copper bonds, which increases density and shortens the lengths of interconnect wiring between chiplets, resulting in improved overall performance, power consumption and cost.
14 Apr 2025
By onsemi Newsroom
onsemi Withdraws Proposal to Acquire Allegro MicroSystems
SCOTTSDALE, Ariz. – April 14, 2025 – onsemi (NASDAQ: ON) today announced that it has terminated its efforts to acquire Allegro MicroSystems, Inc. (“Allegro”) (NASDAQ: ALGM) and withdrawn its all-cash proposal to acquire Allegro for $35.10 per share.
While onsemi continues to believe that a combination of these companies would have brought two highly complementary businesses together, benefiting their respective customers and delivering immediate value to Allegro shareholders, onsemi has determined there is no actionable path forward.
10 Apr 2025
By STMicroelectronics Newsroom
STMicroelectronics details company-wide program to reshape manufacturing footprint and resize global cost base
STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today disclosed further elements of its program to reshape its global manufacturing footprint. This comes as part of the program announced in October 2024 to further strengthen ST’s competitiveness, solidify its position as a global semiconductor leader, and ensure the long-term sustainability of its model as an Integrated Device Manufacturer by leveraging strategic assets globally across technology R&D, design and high-volume manufacturing.
9 Apr 2025
By SEMI
Global Semiconductor Equipment Billings Surged to $117 Billion in 2024, SEMI Reports
MILPITAS, Calif. – April 9, 2025 – Worldwide sales of semiconductor manufacturing equipment increased 10% to $117.1 billion in 2024 from $106.3 billion in 2023, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today. The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report.
In 2024, the global front-end semiconductor equipment market experienced notable growth, with sales of wafer processing equipment increasing by 9% and other front-end segments rising by 5%. This growth was largely fueled by heightened investments in expanding capacity for both leading-edge and mature logic, advanced packaging, and high-bandwidth memory (HBM), alongside a significant rise in investments from China.
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