GlobalFoundries Inc yesterday said it plans to accelerate global capacity optimization and expansion to accommodate exponential growth in radio frequency (RF) and other chips driven by the artificial intelligence (AI) boom.

Singapore will pay a vital role in the company’s capacity expansion, alongside production line optimizations across its manufacturing sites, GlobalFoundries Asia Pacific head Vincent Feng (范曾文) told a news conference in Hsinchu City.

“Many might be surprised to hear that the RF market is thriving now. We are gearing up for a massive capacity expansion, and it is all being driven by AI,” Feng said.

Samsung Electronics and SK hynix's 800 trillion won ($592 billion) memory chip cluster in the southwestern Honam region is targeting first mass production in June 2030. Gwangju is racing to build out power and water infrastructure starting next year, aiming to break ground on the memory chip plants in 2028.

The cluster will comprise at least four memory chip plants, which the two chipmakers have pledged to build to keep pace with AI-driven demand. The site spans 8.3 million square meters (2,040 acres), freed up by the relocation of a military airport in Gwangju.

CXMT officially announced the mass production of 5th-generation DRAM technology platform (the "G5 Platform") at the 2026 World Manufacturing Convention in Hefei, alongside the debut of new LPDDR5X product lineup based on the platform.

With process capabilities rivaling the industry's best mass-produced nodes, the G5 Platform is a milestone for CXMT — bringing more innovative memory solutions and greater supply chain resilience to the global semiconductor ecosystem.

MALTA, N.Y., September 17, 2026 — GlobalFoundries (Nasdaq: GFS) (GF) and Marvell Technology, Inc. (Nasdaq: MRVL), a leader in data infrastructure semiconductor solutions, today announced an expanded multi-year agreement to increase capacity for GF’s silicon germanium (SiGe) technology at its Burlington, Vermont, facility to support growing demand for next-generation optical connectivity.

Modern AI data centers operate as distributed compute systems, where performance depends not only on accelerators, but also on the high-speed interconnects that move data between them. As AI systems scale, moving data efficiently is becoming increasingly critical to overall performance. The expanded collaboration between GF and Marvell will increase capacity for high-performance SiGe technology used in next-generation pluggable optical transceivers, Near-Packaged Optics (NPO) and Co-packaged Optics (CPO).

SCOTTSDALE, Ariz. September 16, 2026 – onsemi today unveiled the Embedded Power Platform (EPP), a breakthrough architecture that uses the silicon wafer itself as the foundation of the package and introduces a highly integrated approach to power system design. Designed as a scalable platform, EPP brings electrical, mechanical and thermal design together from the outset to help customers achieve higher power density, improve system performance and accelerate development in AI, electrification and autonomous applications.

Munich, Germany – 16 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that it has entered into a definitive agreement under which Winbond Electronics Corporation, a Taiwan-based global supplier of semiconductor memory solutions, will acquire Infineon’s NOR Flash and F-RAM business in an all-cash transaction valued at $1.12 billion on a cash and debt free basis. The business comprises a portfolio of NOR Flash memory as well as F-RAM products serving customers across automotive, industrial and infrastructure markets. Subject to obtaining the required regulatory approvals, the parties currently target closing the transaction in the second half of 2027.

ALBANY, N.Y. -- an IBM (NYSE: IBM) company, announced the finalization of a $1 billion award under the CHIPS and Science Act with the U.S. Department of Commerce (the "Department"). The award will accelerate Anderon's R&D efforts to advance the nation's quantum wafer manufacturing capabilities.

Announced in May under a letter of intent between the Department and IBM, Anderon operates a state-of-the-art 300-millimeter pure-play quantum wafer foundry, backed by an additional $1 billion investment from IBM. Headquartered in Albany, New York, the new venture serves the quantum industry as a pure-play foundry, offering quantum wafer manufacturing to customers across the ecosystem.

MediaTek Inc (聯發科) yesterday unveiled a new smartphone chip made using Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) most advanced manufacturing technology, targeting the premium handset market with semiconductors capable of running more artificial intelligence (AI) features directly on the device.

It is part of an effort to gain ground on US rival Qualcomm Inc in premium phones, where higher-priced devices and AI features offer chipmakers better margins.

MediaTek said the Dimensity 9600 Pro is its first mobile processor built using TSMC’s cutting-edge 2-nanometer process. It also introduced the Dimensity 9600M, made using TSMC’s 3nm process and aimed at a broader segment of the flagship smartphone market.

Micron's advanced DRAM packaging enables the 512GB DDR5 RDIMM to unlock data center performance with speeds up to 9,200 MT/s and reduced operating power by more than 60%.

BOISE, Idaho, Sept. 15, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced a major milestone in memory innovation with the successful demonstration of the world's first 512GB DDR5 module on multiple server platforms. The achievement reinforces Micron's leadership in high-performance, high-capacity server memory and provides enterprise data center and cloud customers with a path to support large and demanding AI, analytics, in-memory database and simulation-heavy workloads with greater efficiency. Leading semiconductor enablers, AMD and Intel, are both actively validating the module, which will deliver speeds up to 9,200 MT/s.

STMicroelectronics has presented a strategic project to create a new R&D Digital Twin center that will take shape at the company’s Castelletto site in Lombardy, west of Milan. The initiative aims to strengthen advanced research and development activities, accelerate innovation across the company, and pave the way for product and technology solutions that were previously out of reach.