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16 Jun 2026

By Amkor Technology

TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States

HSINCHU, Taiwan & TEMPE, Ariz.--(BUSINESS WIRE)--Jun. 16, 2026-- Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) today announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.

16 Jun 2026

By Coherent

Coherent Announces a CHIPS Letter of Intent for $50 Million to Expand World-Leading Manufacturing Facility for AI Infrastructure

SHERMAN, TEXAS, June 16, 2026 – Coherent Corp. (NYSE: COHR), the global photonics leader, today announced it has signed a letter of intent to receive up to $50 million in direct funding under the CHIPS and Science Act from the U.S. Department of Commerce to expand its world-leading 6-inch Indium Phosphide (InP) semiconductor manufacturing facility in Sherman, Texas.

10 Jun 2026

By Applied Materials

Applied Materials Expands Singapore Manufacturing to Support AI Chip Demand

SINGAPORE and SANTA CLARA, Calif., June 09, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering solutions for the semiconductor industry, has expanded its manufacturing and R&D operations in Singapore to support the global build-out of AI infrastructure. The new US$500 million (S$600 million) Tampines Campus more than doubles Applied’s advanced cleanroom capacity in Singapore and strengthens the company’s global manufacturing footprint, which also includes facilities in the United States, Europe, Israel and Taiwan. The new facility, already operating at volume production, is focused on serving chipmakers that are expanding production to meet increasing AI-driven demand.

5 Jun 2026

By TrendForce

China Launches 8-Inch GaN-on-Silicon Micro LED IDM Production Line

Recently, West Lake Yanshan Technology (Hangzhou) Co., Ltd. officially commenced production at what it claims is the world’s first 8-inch GaN-on-Silicon Micro LED IDM mass production line, located at its factory in Deqing, Zhejiang Province.

The newly launched line adopts a full-chain IDM model, covering the entire manufacturing process from epitaxial material growth and chip fabrication to advanced packaging. The facility enables integrated closed-loop production from silicon-based GaN epitaxy to finished Micro LED devices.

3 Jun 2026

By Taipei Times

SK Hynix plans to double capacity to ease memory crunch

SK Hynix Inc plans to double its memory chip capacity over the coming half-decade, a major expansion that should help ease a global shortage of an essential component of artificial intelligence (AI). The company is responding to an endemic deficit of storage chips that could last till 2030, SK Group chairman Chey Tae-won told reporters in Taipei, upholding a previous estimate.

SK Hynix is ramping up spending to address that demand-supply imbalance though it is hard to quantify because of volatile prices for a panoply of resources including land, equipment and electricity, Chey said.

27 May 2026

By Reuters

Samsung plans $1.5 billion chip testing plant in Vietnam, document shows

HANOI, May 27 (Reuters) - Samsung Electronics (005930.KS), opens new tab plans to invest 39 trillion dong ($1.5 billion) ​in Vietnam to build a semiconductor testing plant, its proposal document showed, an expansion that will help ‌ease a global shortage of memory chips driven by surging AI demand.
The new factory, for which construction has already begun in an industrial park 60 kilometres (37 miles) north of Hanoi, is slated to start operations in November 2027, the document sent to local authorities in April and reviewed by Reuters ​showed.

26 May 2026

By Taipei Times

ASML plans to hire 1,000 in Taiwan to meet client demand growth

Dutch semiconductor equipment manufacturer ASML Holding NV announced an upward adjustment to its Taiwan recruitment strategy, raising its hiring target to 1,000 new employees this year. According to Grace Wang, Vice President and General Manager of ASML Taiwan, this increases the initial goal of 600 hires to satisfy surging client demand. The upcoming recruitment push will primarily target roles in customer support, manufacturing, and supply chain management. This expansion aims to support local clients as they scale up operations while simultaneously accelerating ASML’s global production capability.

26 May 2026

By Lattice Semiconductor

Lattice to Acquire AMI, Creating the Industry’s Most Complete Secure Management and Control Platform

HILLSBORO, Ore.--(BUSINESS WIRE)--May 4, 2026-- Lattice Semiconductor (NASDAQ: LSCC) today announced it has entered into a definitive agreement with THL Partners to acquire AMI, the leader in platform firmware and infrastructure manageability for cloud and AI, creating the industry’s most complete secure management and control platform. The planned acquisition advances Lattice’s strategy to expand its position in server, AI, and cloud applications spanning hardware, security, manageability, and control. Lattice expects the acquisition to be accretive to gross margin, free cash flow, and EPS on a non-GAAP basis, and it supports Lattice’s trajectory toward a $1 billion+ annual revenue run rate by Q4 2026.

21 May 2026

By AMD

AMD Announces More Than $10 Billion in Taiwan Ecosystem Investments to Accelerate AI Infrastructure

SANTA CLARA, Calif., May 21, 2026 (GLOBE NEWSWIRE) -- To meet the growing demand for AI infrastructure, AMD (NASDAQ: AMD) today announced more than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure.

Working with strategic partners in Taiwan and globally, AMD is advancing leading-edge silicon, packaging and manufacturing technologies that enable higher performance, greater efficiency and faster deployment of AI systems. These efforts build on AMD’s deep ecosystem partnerships and long-standing leadership in chiplet architectures, high-bandwidth memory integration, 3D hybrid bonding and rack-scale system design for next-generation AI infrastructure.

19 May 2026

By Analog Devices

Analog Devices to Acquire Empower Semiconductor, Expanding its Next-Generation High-Density Power Portfolio for the AI Era

Analog Devices, Inc. (NASDAQ: ADI) and Empower Semiconductor today announced that they have entered into a definitive agreement under which ADI will acquire Empower in an all-cash transaction for $1.5 billion.

As AI compute scales, power density – not just total watts – has become the limiting factor. Delivering high-density, high-efficiency power at the point of compute, while responding to fast-changing demands, is now one of the most critical challenges in system design. Together, ADI and Empower will help shape the power delivery architecture for AI and other compute-intensive applications.

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