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Industry News

2 Jan 2025

By Yahoo! Finance

China's No 2 chip foundry Hua Hong names former Intel veteran as new president

China's Hua Hong Semiconductor (688347.SS), the country's second-largest chip foundry, has hired a former Intel (INTC) veteran as its new president amid a management reshuffle.

1 Jan 2025

By Commercial HVAC & Refrigeration Services

AIM Act Drives Low–GWP Refrigerant Requirements

From January 1, 2025, U.S. commercial refrigeration systems must use refrigerants with GWP below 150–300. California has stricter rules on phasing down high-GWP refrigerants.

30 Dec 2024

By TAIPEI TIMES

TSMC plans two more Kaohsiung fabs

SEMICONDUCTORS: The firm has already completed one fab, which is to begin mass producing 2-nanomater chips next year, while two others are under construction

30 Dec 2024

By Governor of Virginia

Micron Technology to Expand Semiconductor Manufacturing Facility in Manassas

Global technology leader will invest up to $2.17 billion and create 340 new jobs

21 Dec 2024

By Reuters

UK watchdog says $35 bln Synopsys-Ansys deal raises competition concerns

Dec 20 (Reuters) - The UK's competition watchdog said on Friday that chip design software maker Synopsys' (SNPS.O), opens new tab $35 billion acquisition of Ansys (ANSS.O), opens new tab could reduce innovation and lead to higher prices but it could approve the deal if those concerns are resolved.

19 Dec 2024

By Taipei Times

Biden to announce Chinese semiconductor probe

HANDOVER POLICY: Approving the probe means that the new US administration of Donald Trump is likely to have the option to impose trade restrictions on China

19 Dec 2024

By Taipei Times

UMC says has no plans to build in US

United Microelectronics Corp (UMC, 聯電) yesterday said that it has no immediate plans to set up a production site in the US amid speculation that the Taiwanese company might come under pressure to invest in the US market.

19 Dec 2024

By U.S. Department of Commerce - News

CHIPS Investment Establishes a Research Hub in Indiana and Brings Next Generation HBM and Advanced Packaging R&D to the U.S.

CHIPS Investment Establishes a Research Hub in Indiana and Brings Next Generation HBM and Advanced Packaging R&D to the U.S.

18 Dec 2024

By PR Newswire

Rapidus begins installation of Japan's first NXE:3800E EUV lithography machinery for semiconductor mass production

HOKKAIDO, Japan, Dec. 18, 2024 /PRNewswire/ -- Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced the delivery and installation of ASML's EUV lithography equipment at its Innovative Integration for Manufacturing (IIM-1) foundry, an advanced semiconductor development and manufacturing fab currently under construction in Chitose, Hokkaido. To commemorate the installation, a ceremony was held at Portom Hall in the New Chitose Airport.

18 Dec 2024

By Taipei Times

GlobalWafers to get US$406m from US

CHIP SUBSIDY: The US funding would help alleviate the financial pressure from building two fabs in the US and should lift gross margins in 2026, the company said

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