TEMPE, Ariz.--(BUSINESS WIRE)--May 19, 2026-- Amkor Technology, Inc. (Nasdaq: AMKR) today reinforced its commitment to expanding Advanced semiconductor packaging and test capabilities in the United States through continued investment in its Arizona manufacturing footprint. Located within Peoria’s Innovation Core, Amkor’s campus is being developed on a 104-acre site designed to support large-scale, leading-edge semiconductor packaging and test capabilities. As part of its long-term growth strategy, Amkor has now secured an additional 67-acre parcel adjacent to the existing campus, providing strategic flexibility to support future expansion and evolving customer demand.

May 8 (Reuters) - Intel (INTC.O), opens new tab has reached a preliminary deal to make some chips for Apple (AAPL.O), opens new tab devices, the Wall Street Journal reported on ​Friday, in a potential boost to Intel's contract manufacturing business and Washington's push to shore up ‌U.S. chip production.
The companies were engaged in intensive talks for more than a year and they hammered out a formal deal in recent months, the report said, citing people familiar with the matter.

KAOHSIUNG, Taiwan, May 8, 2026. Advanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung. The two companies plan to jointly deploy resources to expand advanced manufacturing capacity that will reinforce Taiwan’s critical position in the global semiconductor value chain.

TAIPEI (Taiwan News) — TSMC plans to build nine new plants worldwide this year, including advanced process and advanced packaging facilities, to expand its global footprint.

The company said it also started construction on nine plants last year, most of which were advanced wafer fabs. The number rose from three in 2022 to six in 2024, reflecting growing demand for advanced process and packaging capacity, per Economic Daily News.

The company plans to expand its 3-nm wafer fab at the Southern Taiwan Science Park this year. It will also convert part of the 5-nm capacity at Fab 18 to 3-nm production to meet rising demand for high-performance computing devices and AI chips.

Foundry service provider Vanguard International Semiconductor Corp (世界先進) yesterday said it is adjusting its product portfolio for its new 12-inch fab in Singapore to meet a customer’s demand for interposers used in advanced packaging technology for artificial intelligence (AI) chips.

Vanguard said it would license and transfer related technologies from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) and manufacturing equipment supplied by the customer to produce interposers on 30-nanometer and 40-nanometer technologies at the fab.

Elon Musk’s plans for a huge chip manufacturing plant in East Texas will cost at least $55 billion for the first phase, and up to $119 billion if the full buildout comes to fruition.

The estimated capital investment amounts were disclosed in a public hearing notice on Wednesday in Grimes County, Texas, home of the prospective facility. The notice said SpaceX, which is controlled by Musk, is seeking a property tax abatement agreement from the county.

SANTA CLARA, Calif., May 03, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.

SANTA CLARA, Calif. – April 22, 2026 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the acquisition of Polariton Technologies, a developer of high-speed, low-power plasmonics-based silicon photonics devices. The acquisition strengthens Marvell’s optical technology portfolio by adding advanced modulation capabilities that enable continued scaling in bandwidth, power efficiency, and integration for next-generation coherent and optical interconnect platforms.

SANTA CLARA, California, April 22 (Reuters) - Taiwan Semiconductor Manufacturing Co (2330.TW), opens new tab plans to open a chip packaging plant in Arizona by 2029, an executive ​told Reuters.
Modern artificial intelligence chips, such as those made by Nvidia (NVDA.O), opens new tab, ‌are not single chips but several chips glued together with advanced packaging technologies, a step that has become a supply bottleneck for Nvidia and others. In a January earnings call, TSMC said it ​was applying for permits to begin construction of its first advanced packaging ​plant in an existing Arizona facility, but did not give a ⁠timeline for when it will come online.

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment (ATE) and advanced robotics, today announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry. TestInsight's advanced tools and expert team will be pivotal in accelerating the development of test solutions on Teradyne platforms, enabling faster and more efficient time to ramp for complex AI devices.