Munich, Germany and Villach, Austria – 11 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter fits 2.3 times as many chips per wafer.

SEOUL, Sept. 11 (Yonhap) -- Unionized office workers at SK hynix Inc., the world's second-largest memory chip maker, have agreed on a 5.7 percent wage hike with the company, industry sources said Wednesday.

Vanguard International Semiconductor Corp (世界先進) and Episil Technologies Inc (漢磊) yesterday announced plans to jointly build an 8-inch fab to produce silicon carbide (SiC) chips through an equity acquisition deal.

AMSTERDAM, Sept 6 (Reuters) - The Dutch government on Friday said it would expand export licensing requirements for some ASML, opens new tab chipmaking equipment, effectively retaking oversight over it from the United States and aligning the two countries' policy.

WASHINGTON, D.C. – The U.S. Commerce Department’s Bureau of Industry and Security (BIS) published an interim final rule (IFR) today implementing controls on critical and emerging technologies that have reached broad technical agreement among our international partners. This IFR includes controls related to quantum computing, semiconductor manufacturing, and other advanced technologies. Today’s action strengthens our international relationships with like-minded countries and ensures that U.S. export controls keep pace with rapidly advancing technologies that pose serious threats to our national security when in the wrong hands.

Hsinchu, Eindhoven, Sep. 4, 2024 –Vanguard International Semiconductor Corporation (VIS, TPEx 5347) and NXP Semiconductors N.V. (NXP, NASDAQ: NXPI) today announced that they have obtained all necessary approvals from relevant authorities and injected capital to officially establish the VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) joint venture. The company will now proceed with the planned construction of VSMC’s first 300mm wafer manufacturing facility.

Taipei, Sept. 3 (CNA) A group of over 30 companies, including Taiwan Semiconductor Manufacturing Co. (TSMC), announced the formation of the Silicon Photonics Industry Alliance (SiPhIA) Tuesday.

At a launch event for the alliance at SEMICON Taiwan, K.C. Hsu (徐國晉), TSMC's vice president of Integrated Interconnect & Packaging, said that as the artificial intelligence (AI) era requires massive computing power, "energy efficiency has become a significant issue."

ams OSRAM completes the transaction to sell Passive Optical Components assets to Focuslight Technologies Inc.

- Sale of relevant Passive Optical Components assets completed
- Sales price of approx. EUR 45m in cash received
- Strategic efficiency program ‘Re-establish the Base’ on track

New Agreement to Accelerate Development and Volume Production of Finwave's E-Mode MISHEMT RF GaN-on-Si Technology

NVIDIA (NASDAQ: NVDA) today reported revenue for the second quarter ended July 28, 2024, of $30.0 billion, up 15% from the previous quarter and up 122% from a year ago.

For the quarter, GAAP earnings per diluted share was $0.67, up 12% from the previous quarter and up 168% from a year ago. Non-GAAP earnings per diluted share was $0.68, up 11% from the previous quarter and up 152% from a year ago.