According to data released by the Semiconductor Equipment Association of Japan (SEAJ) on August 27th, Japan’s semiconductor manufacturing equipment sales continue to soar, with July sales up by about 20%, marking four consecutive months of double-digit growth. Sales from January to July reached a historic high for the period.

STRATEGIC SHIFT: Diversifying away from the volatile flat-panel industry, AUO aims to boost sales contribution from non-panel business to half of total revenue by 2027

Today, the Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (“R&D”) activities to commercial manufacturing operations. President Biden and Vice President Harris championed the CHIPS and Science Act, a key component of the Investing in America agenda, to usher in a new era of semiconductor manufacturing in the United States, bringing with it a revitalized domestic supply chain, good-paying jobs, and investments in the industries of the future. Through this proposed investment, the Biden-Harris Administration would enhance U.S. technological leadership by driving innovation of groundbreaking semiconductor technologies that serve important end markets, notably including life sciences instrumentation and technology hardware used in artificial intelligence applications.

TSMC is likely to see its 3nm and 5nm nodes generate more than NT$1 trillion (US$31.02 billion) in total revenue in the first three quarters of this year, as the foundry house's sales momentum remains strong in the third quarter of 2024.

DRESDEN, Germany August 20, 2024— ESMC – a joint venture between TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. – today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. The event brought together government officials, customers, suppliers, business partners and academia to celebrate a milestone in establishing what will be the EU’s first-ever FinFET-capable pure-play foundry.

Strategic acquisition to provide AMD with industry-leading systems expertise to accelerate deployment of optimized rack-scale solutions addressing $400 billion data center AI accelerator opportunity in 2027

- ZT Systems, a leading provider of AI and general purpose compute infrastructure for the world’s largest hyperscale providers, brings extensive AI systems expertise that complements AMD silicon and software capabilities
- Addition of world-class design and customer enablement teams to accelerate deployment of AMD AI rack scale systems with cloud and enterprise customers
- AMD to seek strategic partner to acquire ZT Systems’ industry-leading manufacturing business
- Transaction expected to be accretive on a non-GAAP basis by the end of 2025

The latest round of funding brings the size of the Shanghai Semiconductor Industry Investment Fund to US$2 billion

Taipei, Aug. 16 (CNA) Contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) will spend NT$17.14 billion (US$531 million) to purchase a plant and equipment in the Southern Taiwan Science Park from flat panel maker Innloux Corp.

August 15, 2024 /SemiMedia/ -- According to recent reports, Shin-Etsu Chemical and SUMCO, two leading players in the global silicon wafer market, experienced a year-on-year decline in demand during the second quarter of 2024. This trend highlights a slow recovery in the market, despite some positive signs.

Taipei, Aug. 14 (CNA) Taiwan-based manufacturing giant Hon Hai Precision Industry Co. on Wednesday reported its highest-ever second quarter net profit amid a boom in artificial intelligence development worldwide.