Intel has sold its 1.18 million share stake in British chip firm Arm Holdings, according to a regulatory filing, as the California chip designer shores up its balance sheet amid intense competition.

FOPLP PLANS? The chipmaker said the budget was for fab construction and manufacturing facilities, but did not comment on reports of talks with Innolux

BUILD-OUT: The company is expanding to meet the needs of production capacity amid growing demand for advanced packaging services for AI and HPC chips

TSMC has notified clients of a 3-8% price increase for its 5nm and 3nm process manufacturing in 2025 to reflect escalating costs, according to sources at IC design houses.

Munich and Taipei – 1 August 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has completed the sale of its two backend manufacturing sites, one in Cavite, Philippines and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE, a leading provider of independent semiconductor manufacturing services in assembly and test.

SEOUL, July 29 (Yonhap) -- Samsung Electronics Co. and its largest labor union were set to resume wage talks again Monday following an unsuccessful initial meeting amid an ongoing strike, industry sources said.

Company confirms investment for the construction of auxiliary facilities necessary for the initial operation of Yongin 1st Fab and the Cluster
Yongin Cluster expected to increase the competitiveness of the Korean semiconductor industry and contribute to revitalizing the economy

Samsung Electronics is reportedly adjusting its investment pace and postponing the construction of the wafer foundry line at its Pyeongtaek Plant 4 (P4) due to difficulties in securing major foundry customers.

AUSTIN, Texas — Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the Department of Defense. Under the agreement, TIE will establish a national open access R&D and prototyping fabrication facility that will enable DOD to create higher performance, lower power, light weight and compact defense systems. Such technology could apply to radar, satellite imaging, unmanned aerial vehicles or other systems.

As Samsung eagerly accelerates its pace on the HBM3e certification with NVIDIA, SK hynix, the current HBM market leader, is reportedly planning another move to strengthen its relationship with the AI giant. According to a report by Korean media Money Today, SK hynix is teaming up with Amkor Technology to target the silicon interposer market, eyeing to become a supplier for NVIDIA.