New high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy
Projected 5 billion euros multi-year investment program including 2 billion euros support provided by the State of Italy in the framework of the EU Chips Act
Catania Silicon Carbide Campus realizes ST’s plan for fully vertically integrated SiC capabilities from R&D to manufacturing, from substrate to module, on one site, enabling automotive and industrial customers in their shift to electrification and higher energy efficiency.

According to Daily Telegraph, Coherent’s fab located in Newton Aycliffe, County Durham, Northern England, is facing potential sale or closure as Apple ceased a supply agreement. Currently, the plant is under review, which might turn out to be sold. Coherent has issued a last-time-buy notice to its customers.

The construction of Intel's Fab 29 module 1 and module 2 near Magdeburg, Germany, has been delayed due to pending EU subsidy approval and the necessity to remove black soil to reuse it at a different site, with a new timeline pushing the start to May 2025, reports Volksstimme. The fab could still come online more or less on time in late 2027 – early 2028 if Intel is quick with construction and tool installation. But this could still be an issue for the company.

According to a report from a Japanese media outlet The Daily Industrial News, it reported that Micron Technology plans to build a new plant in Hiroshima Prefecture, Japan, for the production of DRAM chips, aiming to begin operations as early as the end of 2027.

KUALA LUMPUR, May 28 (Reuters) - Malaysia is targeting at least 500 billion ringgit ($107 billion) in investment for its semiconductor industry, Prime Minister Anwar Ibrahim said on Tuesday, as the Southeast Asian country looks to position itself as a global manufacturing hub.

BEIJING, May 27 (Reuters) - China has set up its third planned state-backed investment fund to boost its semiconductor industry, with a registered capital of 344 billion yuan ($47.5 billion), according to a filing with a government-run companies registry.

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) yesterday said it has obtained permanent authorization from the US government, confirming that the items and services subject to US export control regulations could continue to be provided to TSMC’s Nanjing fab without the need for vendors to get individual licenses.

AI-DRIVEN: Strong artificial intelligence server demand, along with a mild recovery in smartphone and PC demand, would fuel the semiconductor sector’s growth, TSMC said

Siliconware Precision Industries Co., Ltd. (SPIL), a major global semiconductor packaging and testing company, celebrated a significant milestone today with the ground-breaking ceremony of its Malaysia P1 plant at Bandar Cassia Technology Park, Pulau Pinang. This state-of-the-art 8-hectare facility represents a substantial investment of RM6 billion. Over the next 15 years, the plant is projected to create nearly 3,000 skilled jobs, introduce advanced packaging and testing technologies such as wafer bumping, and offer comprehensive turnkey solution (including wafer bumping, wafer-level chip packaging, flip chip packaging and testing). This initiative is expected to significantly reduce production cycles, enhancing efficiency and competitiveness in the semiconductor industry.

Samsung Electronics’ sudden replacement of the head of its semiconductor business with Vice Chairman Jun Young-hyun on May 21 signals a heightened awareness of challenges within the company. This off-cycle personnel change, specifically targeting semiconductor leadership, reflects Samsung’s response to the threat posed by SK Hynix in the global memory semiconductor market. Following significant losses in the DS division last year, discussions about replacing its former head, Kyung Kye-hyun, arose but were postponed as the memory semiconductor market rebounded. However, continued delays in supplying Nvidia with the next-generation memory semiconductor, HBM, have reportedly increased internal concerns at Samsung. Discussions indicate that the ongoing delay in Nvidia’s HBM verification process, which is currently underway, was a decisive factor in the personnel change.