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Industry News

1 Sept 2025

Emerging HVAC Trends for 2025—Smart, Green, Precise

Innovations include connected HVAC, predictive maintenance, green refrigeration, energy recovery ventilation, immersive training, and renewable integration.

1 Sept 2025

By SCMP

SMIC to take full control of subsidiary chip foundry as China’s fab industry consolidates

Semiconductor Manufacturing International Corporation (SMIC), China’s largest contract chipmaker, said it planned to buy all of a foundry it controls as the nation’s fab industry undergoes a wave of consolidation.
In a statement last week, the company said it planned to buy the remaining equity interest in Semiconductor Manufacturing North China (Beijing) Corporation (SMNC), a subsidiary that is currently 51 per cent owned by SMIC.

1 Sept 2025

By TrendForce

2Q25 Foundry Revenue Surges 14.6% to Record High, TSMC’s Market Share Hits 70%, Says TrendForce

TrendForce’s latest investigations reveal that global foundry revenue in 2Q25 reached a record US$41.7 billion, up 14.6% QoQ, thanks to China’s consumer subsidy program spurring early stocking, along with upcoming demand for new smartphones, notebooks/PCs, and servers launching in the second half of the year. Both capacity utilization and wafer shipments improved significantly across the top ten foundries.

29 Aug 2025

By Taipei News

TSMC to break ground on advanced fab in October

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is expected to start construction of its 1.4-nanometer chip manufacturing facilities at the Central Taiwan Science Park (CTSP, 中部科學園區) as early as October, the Chinese-language Liberty Times (the Taipei Times’ sister newspaper) reported yesterday, citing the park administration.

TSMC acquired land for the second phase of the park’s expansion in Taichung in June.

Large cement, construction and facility engineering companies in central Taiwan have reportedly been receiving bids for TSMC-related projects, the report said.

28 Aug 2025

By Amkor Press

Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility

TEMPE, Ariz.--(BUSINESS WIRE)--Aug. 28, 2025-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.

The facility will be constructed on a 104-acre site within the Peoria Innovation Core, in north Peoria, AZ. Peoria City Council unanimously approved a land swap and an amended development agreement, allowing Amkor to exchange its previously designated 56-acre parcel within the Five North at Vistancia community. Construction of the facility will begin within days, with production expected to start in early 2028.

27 Aug 2025

By AXIOS Media

TSMC building water reclamation plant for Phoenix facilities

Taiwan Semiconductor Manufacturing Co. broke ground this month on a reclamation plant to reuse "nearly every drop of water" at its massive north Phoenix manufacturing complex, the company announced Wednesday.

Why it matters: Water is a precious commodity in the Valley, and TSMC began operations in Phoenix at a time when the Colorado River basin is in a long-term "megadrought."

26 Aug 2025

By Trendforce

TSMC Reportedly Fast-Tracks U.S. Packaging Plants for 2H26 Construction, 2028 Production

Amid scrutiny over Washington’s 10% stake in Intel, TSMC is pressing ahead with its U.S. expansion. MoneyDJ reports that site prep is underway for its two advanced packaging plants (AP1, AP2) in Arizona, with construction set to begin in 2H26 and production by 2028.

The report also details TSMC’s plan for the two advanced packaging plants, adding that AP1 will focus on expanding SoIC (System-on-Integrated-Chips) and CoW (Chip on Wafer) technologies, while AP2 will specialize in CoPoS (Chip-on-Panel-on-Substrate) to meet local demand for AI and HPC chip packaging.

As Commercial Times previously reported, citing sources in the supply chain, TSMC’s U.S. facilities will initially center on SoIC (System-on-Integrated-Chips) and CoW (Chip-on-Wafer), while the back-end oS (on-Substrate) stage will be handled by Amkor.

25 Aug 2025

By The Korea Herald

Hyundai, Kia join hands with LG Energy Solution, Samsung SDI, SK On to advance EV battery safety technology

Hyundai Motor, Kia and Korea’s three leading battery-makers -- LG Energy Solution, Samsung SDI and SK On -- have agreed to strengthen collaboration to bolster safety technology for electric vehicle batteries, officials said Friday.

Representatives from the companies shared the results of their joint task force, which was discreetly formed in August last year when Hyundai and Kia asked the battery-makers to form a working group on EV battery safety. They had also signed a partnership to further advance their work at Hyundai Motor Group Namyang R&D Center in Gyeonggi Province.

22 Aug 2025

By The Business Times

Tesla to integrate Deepseek, Doubao AI voice controls in China

[BEIJING] Tesla plans to introduce in-car voice assistant functions powered by Deepseek and Bytedance’s Doubao artificial intelligence as it aims to catch local rivals who offer similar features.

The technology allows drivers to use voice commands to control navigation apps, in-car entertainment and cabin temperature, as well as receive news updates, according to a terms and service document uploaded to Tesla’s official website.

21 Aug 2025

By vrt nws

Pioneering photonics business to be built on site of former BelGaN factory

A new chip factory is to be built in Oudenaarde on the former site of BelGaN, the chip manufacturer that went bankrupt last year. Thema Foundries is investing €200 million in what is set to become Europe’s first fully fledged production and service centre for integrated photonics. The move will create around 500 jobs.

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